- All sections
- B - Performing operations; transporting
- B81C - Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems
- B81C 3/00 - Assembling of devices or systems from individually processed components
Patent holdings for IPC class B81C 3/00
Total number of patents in this class: 634
10-year publication summary
|
59
|
39
|
47
|
63
|
56
|
43
|
35
|
40
|
24
|
12
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
36 |
| Robert Bosch GmbH | 40953 |
35 |
| Murata Manufacturing Co., Ltd. | 22355 |
10 |
| InvenSense, Inc. | 1014 |
10 |
| Corning Incorporated | 9932 |
9 |
| Konica Minolta Opto, Inc. | 1179 |
8 |
| Pioneer Corporation | 4843 |
8 |
| Hamamatsu Photonics K.K. | 4161 |
8 |
| Panasonic Corporation | 20786 |
7 |
| Hewlett-Packard Development Company, L.P. | 28538 |
7 |
| Alps Electric Co., Ltd. | 851 |
7 |
| Seiko Epson Corporation | 18724 |
6 |
| Konica Minolta, Inc. | 8349 |
6 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
6 |
| Agency for Science, Technology and Research | 3512 |
6 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
6 |
| Illumina, Inc. | 2771 |
6 |
| The Regents of the University of California | 18943 |
5 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
5 |
| Denso Corporation | 23338 |
5 |
| Other owners | 438 |